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Diced Wafer Selection Tool for Direct Chip to Module Transfer Disclosure Number: IPCOM000059500D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue


Related People

Chi, CK Gardineer, B Khoury, HA Lee, WT [+details]


Linear Device Banks (LDB) or modules can be populated directly with semiconductor chips from diced wafers by mounting said diced wafers on slides and inserting multiples of said slides into cassettes. The cassettes can then be loaded into a transfer tool wherein the chip can be inventoried by cassette and slide number for selection and insertion into the component device.