A Laser Cleaning Process to Remove Debris And Contaminations on the Bonding Pad
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-16
Debris and contamination introduced to substrate bonding pad surfaces by laser line delete processing has a deleterious effect on subsequent wire bonding and isolation resistance forming operations. This article describes a follow-on laser cleaning process for removing such damage.