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A Laser Cleaning Process to Remove Debris And Contaminations on the Bonding Pad

IP.com Disclosure Number: IPCOM000059501D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Beckham, KF Hu, DC Hurst, JE Ray, SK Shih, DY Ziemins, UA [+details]

Abstract

Debris and contamination introduced to substrate bonding pad surfaces by laser line delete processing has a deleterious effect on subsequent wire bonding and isolation resistance forming operations. This article describes a follow-on laser cleaning process for removing such damage.