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An Improved, Wire-Size Independent, Ultrasonic Bonder Tip for Fine Wire Attachments Disclosure Number: IPCOM000059545D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue


Related People

Handford, EF Interrante, MJ Seshan, K [+details]


This article describes a bonding tool tip design incorporating a "V" shaped groove, in combination with a standard cross groove, which provides a stronger wire bond than one obtained by use of other available tip designs. The disclosed tool tip design allows the effective use of bond wire sizes in the order of 1.5 mil to 1.0 mils.