Browse Prior Art Database

An Improved, Wire-Size Independent, Ultrasonic Bonder Tip for Fine Wire Attachments

IP.com Disclosure Number: IPCOM000059545D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Handford, EF Interrante, MJ Seshan, K [+details]

Abstract

This article describes a bonding tool tip design incorporating a "V" shaped groove, in combination with a standard cross groove, which provides a stronger wire bond than one obtained by use of other available tip designs. The disclosed tool tip design allows the effective use of bond wire sizes in the order of 1.5 mil to 1.0 mils.