Browse Prior Art Database

Construction to Reduce Stress in TCM Substrate

IP.com Disclosure Number: IPCOM000059547D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Lipschutz, LD Wong, AC [+details]

Abstract

A proposal suggests changing the rectangular cross-section of the elastomeric cushion used on thermal conduction module substrates (TCM) to a design which redistributes the load as the substrate is clamped. The development would serve to reduce stress at the seal interface.