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Low Temperature Tungsten Film Deposition Process

IP.com Disclosure Number: IPCOM000059577D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Ahn, KY Fryer, PM [+details]

Abstract

A technique is described whereby the deposition of tungsten films is performed at significantly lower temperatures enabling the use of low temperature insulators in very large scale integrated circuits.