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Mechanical Holder for Automatic Mechanical/Chemical Grinding, Lapping And Polishing of Wafer Batches Disclosure Number: IPCOM000059593D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16

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Related People

Mauer, JL McFarland, PA Wong, CY [+details]


A technique is described whereby a mechanical holder is designed to handle many different wafer size varieties and to be enabled to process up to twelve batches of wafers simultaneously, as they are held in the grounding, lapping and polishing process in the manufacture of semiconductors.