Browse Prior Art Database

Mechanical Holder for Automatic Mechanical/Chemical Grinding, Lapping And Polishing of Wafer Batches

IP.com Disclosure Number: IPCOM000059593D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Mauer, JL McFarland, PA Wong, CY [+details]

Abstract

A technique is described whereby a mechanical holder is designed to handle many different wafer size varieties and to be enabled to process up to twelve batches of wafers simultaneously, as they are held in the grounding, lapping and polishing process in the manufacture of semiconductors.