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TiSi2 Films With Improved Thermal Stability

IP.com Disclosure Number: IPCOM000059595D
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
D'Heurle, FM Gas, P Ting, CY [+details]

Abstract

This publication describes a technique to increase the tolerable processing temperature of TiSi2 films in VLSI applications. TiSi2 films suffer from a decrease in conductivity and in shape control when annealed at temperatures in excess of 900oC.