TiSi2 Films With Improved Thermal Stability
Original Publication Date: 1988-Dec-01
Included in the Prior Art Database: 2005-Feb-16
This publication describes a technique to increase the tolerable processing temperature of TiSi2 films in VLSI applications. TiSi2 films suffer from a decrease in conductivity and in shape control when annealed at temperatures in excess of 900oC.