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Snap-In Printed Circuit Mounted Speaker

IP.com Disclosure Number: IPCOM000059659D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Joy, EF Greenfield, FF Myers, RL [+details]

Abstract

A technique is described whereby speaker components, as used in Personal Computers, are mounted onto a printed circuit board so as to allow the use of automated assembly techniques. Two stages of operation are utilized, first to allow the mounting hardware to be wave soldered into place, and then the mounting of the speaker assembly itself, utilizing robotic techniques. In prior art, the assembly of the speaker required separate hand operations so as to prevent damage to the speaker cone from high soldering temperatures. The technique described herein provides a surface- mounted socket that can be robotically positioned and then wave soldered to a printed circuit board.