Browse Prior Art Database

Positive Pressure Hermeticity Relaxation

IP.com Disclosure Number: IPCOM000059668D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Martin, GB [+details]

Abstract

In the manufacture of semi-conductor modules, hermetic sealing is critical so as to avoid corrosion of the exposed metallurgy within the device. An article proposes the use of a positive pressure system to maintain a dry, inert atmosphere within the module, thereby preventing the intrusion of corrosives. A method is proposed which would utilize a dry, inert gas--such as nitrogen--inside of the module. A positive pressure maintained within the module would prevent the entry of gasses or moisture which might otherwise cause corrosion. A central source within the computer proper would be used to pump filtered, dry N2 to each of the modules contained therein.