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Electroless Copper Initiation "Take" Improvement by the Addition of Trace Metal Ions

IP.com Disclosure Number: IPCOM000059687D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Bindra, P McBride, DG Roldan, J [+details]

Abstract

To initiate electroless copper plating a catalyst is needed. Palladium (Pd) is the most commonly used metal for initiation and is deposited in a two-step operation: Sn2+ is adsorbed onto the non-conductive substrate from a SnCl2 solution, followed by the reduction of Pd2+ . Sn2+ is oxidized to Sn4+ in the reaction. The addition of other ions to the Pd Cl2 activation solution can affect the reducing agents' catalytic activity. The addition of parts per million (ppm) amounts of Ag+ to the Pd C12 solution prior to electroless plating increases the amount of copper deposited in a given time. The Ag+ may be added as Ag NO3 . The addition of Ni+ has also been shown to retard the initiation electroless copper plating.