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Method of Uniform Bend Testing of Circuit Assemblies

IP.com Disclosure Number: IPCOM000059799D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Foster, RA [+details]

Abstract

A method which insures consistent bending of circuit assemblies and, therefore, uniform results is described. Quality and reliability assessments of electronic package assemblies, especially those utilizing surface-mounted components, involve bending the panel assembly. Conventionally, this is done utilizing a fixture, as illustrated in Figs. 1A - 1C. As shown, the circuit panel 1 under test is supported by pairs of cylinders along two opposite edges 2. This allows the panel 1 to curve in a cylindrical arc when displaced by the center cylinder pair 3. In order that the stress be uniform across each panel and on all different panels tested, the displacement of movable member 3 should cause smooth, consistent bending.