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Adjustable Insulation for Preventing Overcooling of Finned Components Located Upstream in Air Cooling Path Disclosure Number: IPCOM000059839D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue


Related People

Myers, VH Schmidt, RR [+details]


Circuit devices are provided with fins for improved air cooling, and several of the devices are mounted on a circuit card along an air flow path so that the components upstream are liable to be overcooled. A thermal insulator has bars that fit into the space between fins and thereby reduce the cooling effect of the adjacent fins. End pieces support the bars and snap onto circuit device. The insulator is made of a material such as plastic that permits one or more bars to be broken off to provide more cooling for some modules.