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Ion Implantation of Circuit Board Ceramics

IP.com Disclosure Number: IPCOM000059856D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Batchelder, JS [+details]

Abstract

Ion beam implantation to the periphery of the wafer is used as a means to strengthen and increase fracture resistance of ceramic parts used in first level packaging.