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Bubble Pack Encapsulation for Semiconductor Devices on Plastic Substrates Disclosure Number: IPCOM000059942D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue


Related People

Schrottke, G Talkington, AL [+details]


A process is described for encapsulating semiconductor devices to prevent contamination. This technique applies to an encapsulation process in which a film material (for example, polyimide) dispensed from a roll or other package, is placed over the semiconductor and associated thermal matching materials and bonding methods, and is sealed to the plastic substrate. This encloses the semiconductor and bonds in a "bubble", and the support for the bubble is supplied by the gas that is trapped inside. This prevents any contact between the semiconductor and bonds to any material that will cause a thermal expansion mismatch failure that is encountered in current packaging techniques.