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Surface-Mounted Component Desoldering Tool

IP.com Disclosure Number: IPCOM000059957D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Lawrence, JG [+details]

Abstract

An arrangement is described to safely desolder and remove surface mounted-components with many pins from substrates. The tool, as shown in Fig. 1, consists of the following major features. A compliant head 1. An automatic lifting device 2 capable of supporting an inert gas atmosphere and component ejection. A combination Hot Gas Director/Heat Shield/Heat Sink 3. A Hot/Cold Gas Manifold 4 and a Heat supply 5 including a heating coil with sensor and controller. Due to assembly variations, the components are not in exact locations from card to card. In order to minimize alignment time, the compliant head 1 allows the grippers 2g to go down over the component 10 without precision alignment. If the tool is to be used for manual desoldering only, this is adequate.