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Profiling Dome for Cr-Cu-Au Evaporators

IP.com Disclosure Number: IPCOM000059991D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Brainard, EJ Curry, WJ Miller, PM [+details]

Abstract

A profiling dome with a stepping monitor substantially reduces profiling time in semiconductor manufacturing operations. Conventional techniques for thickness profiling of Cr-Cu-Au evaporation systems only allow for single deposition steps which require excessive set-up time. This is because the monitor slides must be chemically etched in a sequential operation: first the Cr and Cu with overlap, then the Cu, and finally the Au. This requires a pumpdown, deposition, and venting step for each deposition, which is very time consuming. The dome 1 shown in the figure uses two indexing slide monitors 2 to alleviate this problem. In prior systems the stepping thickness monitor was mounted on the evaporation chamber.