Measuring Device for Waterjet Cutting Quality
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
An automatic in-process arrangement to determine the cutting quality of a waterjet that is cutting printed circuit cards is described. A waterjet device is used to profile or cut printed circuit cards out of panels. The cutting is accomplished with a needle-thin stream of high-pressure water discharged through a sapphire orifice at up to three times the speed of sound. The quality of cutting is measured by the extent of delamination, edge surface finish, and width of cut. Cut quality degrades with time as the orifice wears or is otherwise damaged. A method to determine when the orifices should be replaced is described. The only known in-process method to determine quality is a visual observation of the length of the water stream which is clear.