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Process for Enhanced Polyimide Adhesion

IP.com Disclosure Number: IPCOM000060087D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Chaker, M Linde, HG Motsiff, WT Tarasuk, M [+details]

Abstract

An aqueous solution of ethylenediamine (AED) is used prior to the usual amino silane adhesion promoter treatment to improve bonding of polyimide subsequently applied to surfaces comprised of areas of cured polyimide, silicon nitride, and metal, e.g. aluminum copper.