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Heat Dissipation Device And Fabrication Method

IP.com Disclosure Number: IPCOM000060088D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Gautesen, VB Lumbra, DL Phelps, DW [+details]

Abstract

Holes are formed in a polymer tape by punching and a metal tape is adhered to one side of the punched polymer tape. The cavities thus formed are filled with a thermally conductive grease, thus forming a conductive heat path from one metal tape, through the thermal grease in the cavities, to the second metal tape. Semiconductor chips, are pressed into contact with the flexible metal tape at the cavity positions to result in good heat dissipation from the chip.