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Parallel Plate Reactive Ion Etch Plasma Space Modification And Foreign Material Elimination Disclosure Number: IPCOM000060089D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08

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Kerbaugh, ML [+details]


To improve the uniformity of resist etching and to reduce the amount of foreign material which could fall on the wafer resist mask due to sputtering during the etch process, a thin polycarbonate resin disk shield may be mounted under the upper electr