Browse Prior Art Database

Ceramic Module Package for Ic Chips

IP.com Disclosure Number: IPCOM000060096D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Lafer, WF Lovesky, RL [+details]

Abstract

Rectangularly shaped chip carrier substrate 1 is formed with a thin central portion 2 and a thick integral outer rim 3 by inwardly recessing both sides of the planar ceramic stock from which it is made. This configuration allows the integrated circuit (IC) chips 4 to be mounted in the upper recess to the pads of the personalization pattern, not shown, on surface 5 of portion 2, and a ceramic cover 6 to be supported on and sealed, e.g. by a solder bond 6A, to the top side of the rim 3 thereby providing a sealed ceramic module package for the chips 4. The mounting pads, not shown, at the chip mounting sites are connected by fanout conductors, not shown, of the metallization pattern on surface 5 to the input/output (I/O) pin lands, not shown, which in turn are soldered bonded to the respective heads of the I/O pins 7.