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A method for masking a ceramic substrate for a reactive ion etching (RIE) process is described in which the mask is produced from an RIE resistant metal.
English (United States)
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Etching Mask for Ceramic Substrate
A method for masking a ceramic substrate for a reactive ion etching (RIE)
process is described in which the mask is produced from an RIE resistant metal.
The RIE process utilizes a thin organic protective coating 1 on a ceramic
substrate 2 to be etched in a predetermined pattern. This protective coating 1
may be a coating of conventional photoresist which is dried and baked in the
normal fashion. On this layer is deposited, by evaporation or sputtering, a thin
layer 3 of RIE resistant material such as Permalloy, nickel, chromium, zirconium,
etc. On this layer 3, a layer 4 of conventional photoresist is deposited, dried,
baked, exposed and developed in the normal manner. The metal layer 3 is
subtractively etched by conventional wet chemical techniques to produ a
patterned mask in the desired configuration. During the RIE process the
conventional photoresist 4 on top of the metal layer 3 is consumed, but the metal
layer remains intact. Upon completion of the RIE process the masking metal
layer 3 can be rem by lift-off, or by wet etching away the metal, followed by a
conventional photoresist stripping process.