Browse Prior Art Database

Power Distribution Cap

IP.com Disclosure Number: IPCOM000060159D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Blum, A Najmann, K [+details]

Abstract

For the low-ohmic power supply and the mechanical sealing of VLSI packages, a twin cap is proposed which eliminates power supply pins. Modern IC chips are arranged in separate small housings or are flip-chip soldered to substrates of ceramic, plastic, silicon, etc. In such cases, the supply voltages are either fed to solder tags through so-called wirebonds or are applied to solder pins of the substrates through wiring planes. The substrates are covered by metal caps which are merely used as hermetic seals and for inscription. The figure shows an improved embodiment in the form of a twin cap mounted on, say, a multilayer ceramic (MLC) module substrate (not shown). The twin cap comprises an outer GND cap and an insulated inner +V cap connected thereto.