Browse Prior Art Database

Pre-Treatment for UV Solder Resist Coating Disclosure Number: IPCOM000060168D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue


Related People

Naitoh, Y [+details]


To strengthen contact force between a copper surface of a printed circuit board and UV solder resist, the following pre-treatment process is employed before applying the resist onto the board. Neutral dewax. The brown oxidation process is featurized as follows. (Image Omitted)