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Pre-Treatment for UV Solder Resist Coating

IP.com Disclosure Number: IPCOM000060168D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Naitoh, Y [+details]

Abstract

To strengthen contact force between a copper surface of a printed circuit board and UV solder resist, the following pre-treatment process is employed before applying the resist onto the board. Neutral dewax. The brown oxidation process is featurized as follows. (Image Omitted)