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Surface Mount Substrate Lead

IP.com Disclosure Number: IPCOM000060196D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Mullady, RK [+details]

Abstract

This spring mount provides low substrate-to-card mounting height while maintaining a long head length for thermal coefficient of expansion mismatch. The figure shows an edge view of the "snap on" clip 10 and the circuit module substrate 12 which it supports on a printed circuit card 14. The design minimizes the distance 16 between the printed circuit card 14 and the substrate 12 while maintain a long lead length 18. The lead length 18 is generally parallel to the edge 20 of the substrate, and provides the needed flexibility to compensate for the thermal coefficient mismatch between the printed circuit card 14 and the substrate 12.