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Method for a via in a PTH for high-speed high-density I/O interconnection

IP.com Disclosure Number: IPCOM000060258D
Publication Date: 2005-Feb-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a via in a plated through hole (PTH) for high-speed high-density input/output (I/O) interconnection. Benefits include improved functionality, improved performance, and improved power performance