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Alignment Marks on Stacked Packages

IP.com Disclosure Number: IPCOM000060263D
Publication Date: 2005-Feb-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses alignment marks on stacked packages and PCBs to indicate their correct placement in the SMT during X-ray inspections. Benefits include a solution that improves alignment validation and works with a variety of components.