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Improving SJR Through Pad Design with PCB Enhancement

IP.com Disclosure Number: IPCOM000060267D
Publication Date: 2005-Feb-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses discontinued fiber (instead of the current weaved fiber) in the dielectric of the PCB stack. Benefits include strengthening pad adhesion and preventing "cratering" on the metal defined (MD) pad.