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Chip Between Pad Solution for Small Chip Component Tombstoning and Solder Joint Reliability Issues

IP.com Disclosure Number: IPCOM000060268D
Publication Date: 2005-Feb-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that prevents tombstoning and solder joint reliability (SJR) issues by reducing the wetting angle, having 50% of the component height in the groove (to prevent the tilting of the component), and preventing the horizontal crack.