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SMT Solder Joint Reliability Indicator Pad

IP.com Disclosure Number: IPCOM000060270D
Publication Date: 2005-Feb-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that assesses product and solder joint reliability (SJR); it quantifies the strength of the second level interconnect (SLI) by pulling a solder bump that was applied to the board at the same time that the board was assembled during the SMT process.