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Method for a solder stud bump spacer with UV-curable adhesive

IP.com Disclosure Number: IPCOM000060286D
Publication Date: 2005-Feb-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a solder stud bump spacer with ultraviolet (UV) curable adhesive. Benefits include improved functionality, improved performance, improved reliability, and improved process simplicity.