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Substrate Thin Film Separator Disclosure Number: IPCOM000060290D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08

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Related People

Busacco, RA Imming, MM Varcoe, JA [+details]


The deliberate, controlled breaking of substrates for the purpose of initiating the peel-back of thin films for peel tests that verify the adhesion of thin films, e.g., photoresist, dielectric or metallized surfaces, is accomplished in a device that works in the following manner. A substrate 1 (Fig. 1) is located film side up on a recessed work surface 2 on a thin rubber cushion 3. A vee groove 4 is located on the device base 5 under substrate 1. A round rod 6 is placed on the top of substrate 1 along the axis of the desired break. A spring-loaded punch 7 is located directly over substrate 1 on center and perpendicular to the round rod 6. The punch handle 8 is retracted to place spring 9 in compression. When the punch handle 8 is released, the compressed spring 9 acts to force punch 7 downward to strike round rod 6.