Universal Monitored Burn-In Test Technique for IBM Series/1 Input/Output Attachment Cards
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08
A technique is described whereby a circuit provides monitored burn-in capability to microprocessor-based IBM Series/1 (S/1) input/output (I/O) attachment cards. The technique provides for burn-in of cards not originally designed to support burn-in. Burn-in on the Series/1 attachment cards requires that the following two design requirements be made for any attachment intended for monitored burn-in testing: 1. The attachment microcode must sense the presence of a special burn-in indicator jumper on the attachment so as to re-execute the power-on micro-diagnostics on a continuing basis until the jumper is removed. 2. The attachment hardware must generate a "test good" logical transistor-transistor logic (TTL) signal for each successful pass through the card micro-diagnostics.