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Reduced Coupled Noise Technique for Engineering Changes Disclosure Number: IPCOM000060376D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08

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Huang, CC Kraus, CJ Ray, SK Wu, LL [+details]


This article concerns a ground wire technique for reducing unwanted noise coupling or cross-talk between engineering changes (ECs) or repair wires used on high performance multilayer ceramic (MLC) modules. In addition, the impedance of the discrete wire net is controlled, reducing the effect of discontinuities on signal risetime. Printed, buried engineering change wires are currently located in wiring channels to allow for product repair and engineering changes on multilayer ceramic modules. Excessive noise coupling or cross-talk occurring on the discrete wire jumpers that run from chip EC pad to buried EC pad in such modules effectively limits their performance.