Method of Determining If Cracks in Ceramic Exist After Brazing or Soldering, When Covered by Metallic Film
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08
A processing step in the production of semiconductors involves an I/O pin attachment and pull test. Cracking of the ceramic substrate may occur during the test which, if undetected, can result in reliability problems with the completed device. An invention proposes a method of exposing the entire pad/ceramic interface for examination so as to detect any cracks. During testing of pin joints on glass or ceramic modules the criteria for a successful bond is fracture in the braze or solder, or, preferably, in the shank of the pin. Cross-sections of joints which have had all shank fails on the pin sometimes show cracks in the ceramic. This cracking can also be identified on pin brazes which have not been tested.