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New TCM Design Using Bellows

IP.com Disclosure Number: IPCOM000060422D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Galyon, GT Singh, P [+details]

Abstract

This TCM (Thermal Conductive Module) design substantially enhances the TCM cooling process while at the same time lessening the number of parts previously used. Utilizing an innovative four-way valving system, the TCM is now allowed to become a safely handled FRU (Field Replaceable Unit). The piston and spring shown in Fig. 1 have been replaced by the bellows shown in Fig. 2, significantly reducing the resistances in the thermal conductive path. The flexible nature of the bellows, under-water pressure, allows increased contact with the face of the chip (Fig. 2), while at the same time it eliminates the localized stress caused by the piston. Due to the one-piece construction of the FRU (Fig. 3) the TCM is more safely handled during replacement.