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3-D Cooling Assembly for Wafer Scale Integration

IP.com Disclosure Number: IPCOM000060432D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Chu, RC Simons, RE [+details]

Abstract

This innovative cooling assembly, for wafer scale integration, allows interchangeability of either an improved liquid-cooling or air-cooling technique. The rectangular geometry of the unit affords greater compatibility with the second level package. The liquid displacement concept decreases the volume of the coolant and keeps it at a minimum, thereby reducing thermal expansion concerns. It has built-in self-regulation, that is, the higher the power, the faster the recirculation and, therefore, increased heat dissipation. The assembly, shown in Fig. 1, provides the same approximate heat dissipation for either single or multiple wafers 1 by utilizing the vapor 2 and liquid 3 cross-flow channels. Condensing fins 4 are designed to improve condensation and condensate flow control. Fig.