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High Thermal Conductivity Composite Substrate

IP.com Disclosure Number: IPCOM000060452D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Reynolds, SD [+details]

Abstract

A composite substrate is constructed of any of a variety of materials, e.g., ceramic, phenolic, polyamide, or high thermal conductivity composites and cladded together with a perforated copper or aluminum sheet to enhance the thermal efficiency of the substrate and permit a chip junction to operate at a cooler temperature. The composite substrate 1, as seen in the drawing, is positioned with the printed circuitry 2 on the top side. The printed circuitry 2 is attached to heads of pins 3 which go through substrate 1 and coincide with the perforations 4 on copper or aluminum sheet 5 to be cladded to substrate 1. The sheet 5 is attached to substrate 1 with silver epoxy, dry-film epoxy, or any other suitable high conductivity adhesive.