Browse Prior Art Database

Cover/Heat Sink Capacitor Disclosure Number: IPCOM000060526D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue


Related People

Stadler, EE Stahl, R [+details]


To position a semiconductor chip decoupling capacitor as closely as possible to the chip, the latter is directly soldered to the cover of a module or a heat sink. The cover or the heat sink is designed as a high-frequency capacitor. The substrate voltage is applied across the rear side of the chip. Fig. 1 shows a first embodiment, wherein cover 1 takes the form of a capacitor. Chip 2 has its rear side connected to the capacitor, for instance, by soldering or by using a conductive epoxy resin, so that substrate voltage 3 is practically applied without any inductance. The other voltage 4, 5 is fed through chip carrier 6 along a low-inductance path. Seal 8 protects chip 2. The capacitor may also be designed for several potentials. Fig. 2 is a plan view of the connectors. Fig.