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Component-Placement Method for Surface-Mounted Components

IP.com Disclosure Number: IPCOM000060530D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Stadler, EE Stahl, R [+details]

Abstract

A (flexible) carrier for surface-mounting electronic components is provided with holes or special transparent areas characterizing the positions of the components. A foil, acting as a light source, transmits light through the "position" holes or the transparent areas of the carrier. A sensor at the opposite side of the component carrier receives the transmitted light, initiating a placement step. This placement method is self-adjusting and compensates for distortions of the component carrier. The sensor is preferably mechanically coupled to the foil, as shown in Fig. 1. Fig. 2 shows a foil collecting the incoming light and transmitting about 75% of it through the foil edges. As the foil is very thin, a very high light density is obtained at the foil edges. Two foils, positioned, for example, rectangularly to each other (Fig.