Soldering Protruding Pins or Connectors on Flexible Circuits
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08
Conventional methods of solder paste application do not allow protrusions above the printed circuit plane. Some arrangements require the assembly of pinned headers to a polyimide flexible printed circuit. Applying paste to this flex circuit and then placing it over the pins is not feasible because most of the soft paste is distorted or damaged in the process. Also, this flex circuit buckles when placed in the vapor phase reflow process. A pin block assembly using surface mount techniques is fabricated by two different methods. This assembly consists of two (2x10 pin headers) with a plastic interposer and a flexible polyimide printed circuit on top. This unit is joined by soldering the pins extending up through the interposer and circuit. Two methods of assembly are described.