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Solderability Improvement by Impurity Segregation in Tin-bismuth Solder Pots

IP.com Disclosure Number: IPCOM000060601D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08

Publishing Venue

IBM

Related People

Authors:
Hershberger, R Keusseyan, R Ludwig, M Rasile, J Senger, R [+details]

Abstract

By lowering a solder pot's operating temperature from 168ŒC to 137ŒC, contained impurities in the solder will isolate themselves, allowing them to be skimmed off. In that impuritie solder reduce solderability, impurity free tin/bismuth solder is critical to the process of assembling connectors and/or components onto advanced printed circuit boards.