Browse Prior Art Database

Deposition of Sandwich Metallurgy

IP.com Disclosure Number: IPCOM000060616D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Baum, TH Jackson, RL Jones, CR Moylan, CR [+details]

Abstract

Open defects in packaging can be repaired by depositing the repair lines as a sandwich of chromium/copper/chromium. This can be accomplished in two different ways, corresponding to the two different deposition mechanisms.