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Method of Ultrasonically Bonding Thermocouples to Silicon

IP.com Disclosure Number: IPCOM000060662D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Phelps, DW Samuelsen, S Ward, WC [+details]

Abstract

A thermocouple bead is attached to silicon by first ultrasonic bonding a small piece of 0.005 or 0.010 inch diameter aluminum wire to the silicon and then ultrasonic bonding the thermocouple bead to the aluminum.