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Method for Equalizing Chip Power Flow

IP.com Disclosure Number: IPCOM000060667D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Erdelyi, CK [+details]

Abstract

The number of temperature excursions experienced by a CMOS chip is greatly reduced by incorporating on-chip resistive dummy loads which are used when the chip is in an inactive state. By this means, extended life of reliable chip-to-next wiring level interconnection metallurgy is realized.