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Extendable Pre-molded Plastic Package for Integrated Circuits

IP.com Disclosure Number: IPCOM000060675D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Phelps, DW Redmond, RS Ward, WC [+details]

Abstract

A technique is described to encapsulate an integrated circuit (IC) chip into a pre-molded lead frame sub-assembly with an option of mating one sub-assembly to another in such a manner as to provide a double density package. Chips may be mixed or matched and sealed into one integrated package with contact leads on all four sides.