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Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
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A technique is described for removing heat generated by a semiconductor chip/wafer when operating in the vacuum chamber scanning electron microscope (SEM).
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
60% of the total text.
Page 1 of 1
Non-convection Heat Sink for Use in a Vacuum
A technique is described for removing heat generated by a semiconductor
chip/wafer when operating in the vacuum chamber scanning electron microscope
The heat generated by a chip/wafer operating in the vacuum chamber of a
SEM cannot be dissipated by convection and the amount of radiation which takes
place is insufficient to keep a chip/wafer temperature within design limits, causing
Chips/wafers under investigation in a SEM are normally mounted on a
mechanical stage with six or seven degrees of freedom and the linear motion
accuracy is in the order of one micron. Apparatus designed to conduct heat to
the outside surface of a vacuum chamber encounter problems with the flexibility
requirements and this approach becomes impractical.
The figure shows an apparatus for storing heat inside a vacuum chamber in
the form of latent heat and the heat is released from the device by being left
outside the vacuum chamber for an appropriate amount of time. The device
consists of a disk shaped container 10 made up of a bottom half 11 and a top
half 12. The bottom half 11 has a cavity 13 machined into a non- magnetic
material which contains eutectic salt which is not shown. The top and bottom
sealing surfaces 14 are machined to seal the cavity 13 because there is a
pressure differential of approximately one atmosphere when the container 10 is
used in the SEM vacuum chamber. The mechanical sealing surfaces 14 have a