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This article features a technique used to fabricate metal structures on smooth surface wafers which will minimize or elimina tendency for resist to float and slide between long narrow metal lines.
English (United States)
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Product Yield Advancement Test Site Structure With Anti-slip Resist
This article features a technique used to fabricate metal structures on smooth
surface wafers which will minimize or elimina tendency for resist to float and slide
between long narrow metal lines.
When the photoresist structure is used to define families of metal lines of
varying widths and pitches to collect defect size and density distribution data, the
photoresist has a tendency to float and slip; thus shorts can be inadvertently
created with erroneous data resulting.
To correct this condition, an anchor site 10 shown in the Figure was designed
in the resist line 11. Such anchor sites should be about every 50 _m along the
line 11. To accommodate this anchor 10 in line 11 while maintaining the desired
pitch between the lines conformal jogs 12 and 13 must be created in the adjacent
resist lines 14 and 15. This anchor 10 and the conformal jogs 12 and 13 prevent
the photoresist from slipping and errors due to displaced resist are minimized or
Metal lines 18 & 19, interposed between resist lines 11 & 14 and 11 & 15
respectively conform to the resist patterns and can be used as test probes to
monitor for shorts or opens in the metal test maze. Additional metal test lines 16
and 17 can be used to test for both opens and shorts.