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Dimpled Module Cap for Thermal Enhancement

IP.com Disclosure Number: IPCOM000060684D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Funari, J Rivenburgh, DL Wu, JB [+details]

Abstract

Thermal caps for modules are constructed such that pedestals are provided for the purpose of removing heat from chips. The pedestal is necessary because the remainder of the caps interior surface must provide clearance to prevent shorting to adjacent pin heads. Thermal grease is provided as an interface to remove heat from the chip to the pedestal but the grease is often partially displaced due to the movement of the cap during thermal cycling. This results in voids between the chip and the pedestal resulting in hot spots. This grease displacement is eliminated in a cap design that has an interior surface dimpled in such a manner as to create clearance for pin heads and to accommodate the thermal grease thereby eliminating the need for a pedestal.