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Non-cling Spacer Sheet Disclosure Number: IPCOM000060688D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09

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LoDato, VA [+details]


This article describes the design of a flat spacer pad used in the stacking of green ceramic sheets during the fabrication process for semiconductor circuits. The spacer pads are used to provide surface protection on both upper and lower faces of the ceramic sheets. The spacer dimensions are the same as the ceramic sheets to provide full surface protection during handling, storage and further process steps. These spacers are of different and inexpensive materials. When the surface of the contemporary spacer is smooth, electrostatic attraction forces develop which makes the separating of the stacked ceramic sheets from the spacers both difficult and unpredictable. This article applies an embossing technique to the spacer sheet 100 in a pattern 200 as shown in the Figure and 150 are holes in the paper for handling purposes.